Buffer layers on metal surfaces having biaxial texture as superconductor substrates

ABSTRACT

Buffer layer architectures are epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and their alloys for high current conductors, and more particularly buffer layer architectures such as Y 2  O 3  /Ni, YSZ/Y 2  O 3  /Ni, RE 2  O 3  /Ni, (RE=Rare Earth), RE 2  O 3  /Y 2  O 3  /Ni, RE 2  O 3  /CeO 2  /Ni, and RE 2  O 3  /YSZ/CeO 2  /Ni, Y 2  O 3  /Cu, YSZ/Y 2  O 3  /Cu, RE 2  O 3  /Cu, RE 2  O 3  /Y 2  O 3  /Cu, RE 2  O 3  /CeO 2  /Cu, and RE 2  O 3  /YSZ/CeO 2  /Cu. Deposition methods include physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

The United States Government has rights in this invention pursuant to contract no. DE-AC05-96OR22464 between the United States Department of Energy and Lockheed Martin Energy Research Corporation.

CROSS-REFERENCE TO RELATED APPLICATIONS

This is a Divisional of application Ser. No. 09/174,188 filed Oct. 16, 1998, which is a Continuation-In-Part of application Ser. No. 09/096,559 filed Jun. 12, 1998.

The present invention relates to issued U.S. Pat. No. 5,741,377 "Structures Having Enhanced Biaxial Texture and Method of Fabricating Same" by Goyal et al., filed Apr. 10, 1995 and issued Apr. 21, 1998; to pending U.S. patent application Ser. No. 08/670,871 "High Tc YBCO Superconductor Deposited on Biaxially Textured Ni Substrate" by Budai et al., filed Jun. 26, 1996; and also to U.S. Patent Application "MgO Buffer Layers on Rolled Nickel Superconductor Substrates," by Paranthaman et al., filed on Jun. 12, 1998, all of which are hereby incorporated in their entirety by reference.

FIELD OF THE INVENTION

The present invention relates to structures upon which high current conductors may be epitaxially deposited on biaxially-textured rolled substrates of nickel and/or copper and other metals and alloys which can be characterized by a surface having biaxial texture. Also described are methods for fabricating said structures. The structures and methods for making the structures include but are not limited to Y₂ O₃ /SS (SS=Substrate comprising at least one metal and having a surface exhibiting biaxial texture), YSZ/Y₂ O₃ /SS (YSZ=yittria-stabilized zirconia), RE₂ O₃ /SS (RE=Rare Earth), RE₂ O₃ /Y₂ O₃ /SS, Y₂ O₃ /CeO₂ /SS, RE₂ O₃ /Ce₂ O₃ /SS, Y₂ O₃ /YSZ/CeO₂ /SS, RE₂ O₃ /YSZ/CeO₂ /SS, and (RE')_(x) O_(y) /SS (RE'=any combination which includes, but is not limited to Rare Earth elements, wherein x is a value near 2.0, believed to be between about 1.95 and about 2.05, (hereinafter stated as about 2.0), and wherein y is between about 3.0 and about 3.7).

BACKGROUND OF THE INVENTION

It has long been desired to grow biaxially oriented oxide buffer layers other than CeO₂ directly on textured substrates, and also to have a single buffer layer on textured substrates. Also it has been desired to provide an alternative to pulsed laser deposition processes that may be easier to scale up for producing long length substrates.

Recent developments in deposited conductors, both rolling assisted biaxially textured substrates (RABiTS), and ion-beam assisted deposition (IBAD) based on YBa₂ Cu₃ O₇ superconductors are promising, and are herein reported for the first time.

The "deposited conductor" approach described herein is useful for growing superconductors such as REBa₂ Cu₃ O₇, (Bi,Pb)₂ Sr₂ Ca_(n-1) CunO_(2n+4) (n=1-3), Tl₁ Ba₂ Ca_(n-1) Cu_(n) O_(2n+3) (n=1-4), Tl₂ Ba₂ Ca_(n-1) Cu_(n) O_(2n+4) (n=1-3), and Hg₁ Ba₂ Ca_(n-1) Cu_(n) O_(2n+2+)δ (n=1-4) with high critical-current densities. These high J_(c) conductors will be suitable for transmission lines and various other applications. The demonstrated buffer layers may also be useful for photovoltaics, ferroelectrics, sensors, and electro-optic applications.

The following sections of publications also relate to the present invention, and are hereby incorporated by reference:

X. D. Wu, S. R. Foltyn, P. Arendt, J. Townsend, C. Adams, I. H. Campbell, P. Tiwari, Y. Coulter, and D. E. Peterson, Appl. Phys. Lett. 65 (15), Oct. 10, 1994, p1961.

M. Paranthaman et al., Physica C 275 (1997) 266-272.

OBJECTS OF THE INVENTION

Accordingly, it is an object of the present invention to provide new and improved biaxially oriented oxide buffer layers other than CeO₂ directly on textured-Ni and/or Cu substrates.

It is another object to provide an alternative to pulsed laser deposition processes as well as improved buffer layer architectures that may be easier to scale up for producing long length substrates.

Further and other objects of the present invention will become apparent from the description contained herein.

SUMMARY OF THE INVENTION

In accordance with one aspect of the present invention, the foregoing and other objects are achieved by a biaxially textured article which comprises a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and a buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃, the buffer layer being epitaxially disposed upon the biaxially-textured surface of the substrate.

In accordance with a second aspect of the present invention, the foregoing and other objects are achieved by a biaxially textured article which comprises a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; a first buffer layer comprising CeO2, the first buffer layer being epitaxially disposed upon the biaxially textured surface of the substrate; and a second buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃, the second buffer layer being epitaxially disposed upon the biaxially textured surface of the CeO₂.

In accordance with a third aspect of the present invention, the foregoing and other objects are achieved by a biaxially textured article which comprises a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; a first buffer layer comprising CeO₂, the first buffer layer being epitaxially disposed upon the biaxially textured surface of the substrate; a second buffer layer comprising YSZ, the second buffer layer being epitaxially disposed upon the biaxially textured surface of the CeO₂ ; and a third buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃, the third buffer layer being epitaxially disposed upon the biaxially textured surface of the YSZ.

In accordance with a fourth aspect of the present invention, the foregoing and other objects are achieved by a biaxially textured article which comprises a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and a buffer layer comprising (RE')_(x) O_(y), wherein x is about 2.0, and y is between about 3.0 and about 3.7, the buffer layer being epitaxially disposed upon the biaxially textured surface of the substrate.

In accordance with a fifth aspect of the present invention, the foregoing and other objects are achieved by a method for making a biaxially textured article which comprises the steps of: providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and epitaxially depositing upon the biaxially textured surface of the substrate a buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.

In accordance with a sixth aspect of the present invention, the foregoing and other objects are achieved by a method for making a biaxially textured article which comprises the steps of: providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; epitaxially depositing upon the biaxially textured surface of the substrate a first buffer layer comprising CeO₂ ; and epitaxially depositing upon the biaxially textured surface of the CeO₂ a second buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.

In accordance with a seventh aspect of the present invention, the foregoing and other objects are achieved by a method for making a biaxially textured article which comprises the steps of: providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; epitaxially depositing upon the biaxially textured surface of the substrate a first buffer layer comprising CeO₂ ; epitaxially depositing upon the biaxially textured surface of the CeO₂ a second buffer layer comprising YSZ, and epitaxially depositing upon the biaxially textured surface of the YSZ a third buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.

In accordance with an eighth aspect of the present invention, the foregoing and other objects are achieved by a method for making a biaxially textured article which comprises the steps of: providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and epitaxially depositing upon the biaxially textured surface of the substrate a buffer layer comprising (RE')_(x) O_(y), wherein x is about 2.0, and y is between about 3.0 and about 3.7.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings:

FIG. 1 is a schematic diagram of the various buffer layer architectures developed on textured-Ni and/or textured-Cu substrates.

FIG. 2 is the room temperature powder X-ray diffraction pattern for a 100 nm thick Y₂ O₃ film grown on textured-Ni substrates by e-beam evaporation.

FIG. 3 is the Y₂ O₃ (222) pole figure for Y₂ O₃ films grown directly on textured-Ni substrates by e-beam evaporation.

FIG. 4 is the room temperature powder X-ray diffraction pattern for a 100 nm thick Yb₂ O₃ film grown on textured Ni substrates by e-beam evaporation.

FIG. 5 is an X-ray ω scan for a 100 nm thick Yb₂ O₃ -buffered Ni substrates with FWHM of 11.7° for Yb₂ O₃ (400).

FIG. 6 is an X-ray φ scan for a 100 nm thick Yb₂ O₃ -buffered Ni substrates with FWHM of 9.5° for Yb₂ O₃ (222).

FIG. 7 is the room temperature powder X-ray diffraction pattern for a 400 nm thick YSZ film grown on Y₂ O₃ -buffered Ni substrates by rf magnetron sputtering.

FIG. 8 is an x-ray ω scan for a 400 nm thick YSZ film grown on Y₂ O₃ -buffered Ni substrates with FWHM of 9.5° for YSZ (200).

FIG. 9 is an X-ray φ scan for a 400 nm thick YSZ film grown on Y₂ O₃ -buffered Ni substrates with FWHM of 11.7° for YSZ (220).

FIG. 10 is the room temperature powder X-ray diffraction pattern for a 400 nm thick Yb₂ O₃ -film grown on Y₂ O₃ -buffered Ni substrates by rf magnetron sputtering.

FIG. 11 is the room temperature powder X-ray diffraction pattern for Yb₂ O₃ -films grown on CeO₂ -buffered Ni substrates by rf magnetron sputtering.

FIG. 12 is an X-ray ω scan for YBCO film on Yb₂ O₃ /CeO₂ -buffered Ni substrates with FWHM of 7.7° for YBCO (006).

FIG. 13 is an X-ray φ scan for YBCO film on Yb₂ O₃ /CeO₂ -buffered Ni substrates with FWHM of 9.5° for YBCO (103).

FIG. 14 is an X-ray ω scan for YBCO film on Yb₂ O₃ /YSZ/CeO₂ -buffered Ni substrates with FWHM of 6.5° for YBCO (006).

FIG. 15 is an X-ray φ scan for YBCO film on Yb₂ O₃ YSZ/CeO₂ -buffered Ni substrates with FWHM of 8.9° for YBCO (103).

FIG. 16 is the temperature dependence resistivity plot for YBCO film on Yb₂ O₃ /CeO₂ /Ni.

FIG. 17 is the temperature dependence resistivity plot for YBCO film on Yb₂ O₃ /YSZ/CeO₂ /Ni.

FIG. 18 is the temperature dependence resistivity plot for YBCO film on Yb₂ O₃ /Y₂ O₃ /Ni.

FIG. 19 shows the temperature dependence of normalized critical current densities of YBCO deposited on Yb₂ O₃ /YSZ/CeO₂ /Ni, Yb₂ O₃ /CeO₂ /Ni, and Yb₂ O₃ /Y₂ O₂ /Ni. Also included is the result of YBCO deposited on standard YSZ/CeO₂ /Ni architecture for comparison.

FIG. 20 shows the magnetic field dependence of normalized critical current densities of YBCO deposited on Yb₂ O₃ /YSZ/CeO₂ /Ni and Yb₂ O₃ /CeO₂ /Ni. Also included is the result of YBCO deposited on standard YSZ/CeO₂ /Ni architecture for comparison.

FIG. 21 shows the room temperature powder X-ray diffraction pattern for a 90-nm thick Gd₂ O₃ film grown on textured-Ni substrates by e-beam evaporation.

FIG. 22 is X-ray ω scans for a 90-nm thick Gd₂ O₃ -buffered Ni substrate with FWHM of 7.1° for Ni (200) and 5.2° for Gd₂ O₃ (400).

FIG. 23 is X-ray φ scans for a 90-nm thick Gd₂ O₃ -buffered Ni substrate with FWHM of 10.1° for Ni (111) and 9.2° for Gd₂ O₃ (222).

FIG. 24 is a pole figure for Gd₂ O₃ film grown directly on textured-Ni (222) substrate by e-beam evaporation.

For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims in connection with the above-described drawings.

DETAILED DESCRIPTION OF THE INVENTION

This invention describes how to grow biaxially oriented oxide buffer layers other than CeO₂ directly on textured-Ni and/or Cu substrates and other metals and alloys which can be characterized by a surface having biaxial texture, and also describes methods for making buffer layers on textured substrates. High rate depositions are accomplished by the demonstrated reactive evaporation. Some of the buffer layers grown may be excellent diffusion barriers for Ni and/or Cu and may be chemically compatible with the high temperature superconductors. This invention also demonstrates the possibility of having a single buffer layer on textured-Ni and/or Cu substrates. This invention also demonstrates the possibility of obtaining predominantly the single texture component of YBCO superconductors. This invention opens up a wide variety of possibilities of growing several other buffer layers such as REAlO₃ (RE=Rare Earth), AEZrO₃, (AE=Alkaline Earth, Ca,Sr,Ba), RE₂ Zr₂ O₇, Ca-stabilized Zirconia, Ti, Nb or Zr doped CeO₂, and AECeO₃ on either buffered-rolled metal substrates or directly on rolled metal substrates. These buffer layers may be of interest to other areas like photovoltaics, ferroelectrics, sensors and optoelectronic devices.

Buffer layers such as Y₂ O₃, RE₂ O₃, CeO₂, and YSZ were deposited on RABiTS by vacuum processing techniques such as electron-beam evaporation and rf magnetron sputtering. FIG. 1 summarizes the architectures of various buffer layers developed in this invention.

The first buffer layer comprises an epitaxial laminate of Y₂ O₃, RE₂ O₃, RE₂ O₃ /Y₂ O₃ or YSZ/Y₂ O₃ deposited on a biaxially cube textured Ni and/or Cu substrate. The crystallographic orientation of the Y₂ O₃, RE₂ O₃, and YSZ were mostly (100). The second alternative buffer layer comprises an epitaxial laminate of Y₂ O₃ or RE₂ O₃ on CeO₂ -buffered Ni and/or Cu substrates. The third alternative buffer layer comprises an epitaxial laminate of RE₂ O₃ (RE=Rare Earth)/YSZ/CeO₂ /Ni (or Cu). The RE₂ O₃ films were grown epitaxially on YSZ-buffered Ni or Cu substrates. YBCO (YBa₂ Cu₃ O_(7-x)) has also been grown on some of the buffer layers by pulsed laser deposition. An estimated J_(c) of 0.7×10⁶ A/cm² at 77° K and zero field for a film with the architecture YBCO/Yb₂ O₃ /CeO₂ /Ni. A J_(c) of 1.4×10⁶ A/cm² at 77° K and zero field was also obtained for YBCO/Yb₂ O₃ /YSZ/CeO₂ /Ni, and a J_(c) of 0.8×10⁶ A/cm² at 77° K for YBCO/Yb₂ O₃ /Y₂ O₃ /Ni. The above-described buffer layers may also be useful for the subsequent growth of superconductors such as REBa₂ Cu₃ O₇ (RE=Rare Earth), (Bi,Pb)₂ Sr₂ Ca_(n-1) Cu_(n) O_(2n+4) (n=1-3), Tl₁ Ba₂ Ca_(n-1) Cu_(n) O_(2n+3) (n=1-4), Tl₂ Ba₂ Ca_(n-1) Cu_(n) O_(2n+4) (n=1-3), and Hg₁ Ba₂ Ca_(n-1) Cu_(n) O_(2n+2+)δ (n=1-4) that are chemically and epitaxially compatible with Y₂ O₃, and RE₂ O₃ buffer layers.

For purposes herein, the following definitions apply: Biaxial(ly) Texture: The films are oriented in both out-of-plane (along the (001) direction) and in plane (along the (100) direction) directions. Epitaxial(ly): The films grown on a particular substrate will grow in the same orientation of the substrate is defined as epitaxial, for example, cube-on-cube orientation. Thus, a buffer layer as described herein as having been epitaxially deposited upon a biaxially-textured surface also exhibits a biaxially textured surface. RABiTS: Rolling-assisted biaxially-textured substrates; Rare Earth (RE): The group of elements which consists of: La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu. RE': any combination including but not limited to Rare Earth elements. (RE')_(x) O_(y). Any combination including but not limited to Rare Earth oxides, especially wherein x is about 2.0, and y is between about 3 and about 3.7. YBCO: YBa₂ Cu₃ O_(7-x). YSZ: yttria-stabilized zirconia. Table 1 summarizes the list of rare earth oxides and their structure type.

The specific processing conditions of the successful multi-layer sequences are described in detail hereinbelow.

EXAMPLE 1 Growth of Y₂ O₃ on Textured-Ni and/or Cu Substrates by E-beam Evaporation

An electron beam (e-beam) evaporation technique was used to deposit Y₂ O₃ films directly on Ni. The as-rolled Ni substrates were cleaned ultrasonically with both acetone and methanol and recrystallized to the desired (100) cube texture by annealing the substrates at 800° C. for 2 hours in a vacuum of 10⁻⁶ Torr. Biaxially oriented Ni substrates were mounted on a substrate holder with a heater assembly in the e-beam system. After the vacuum in the chamber had reached 1×10⁻⁶ Torr at room temperature, a gas mixture of 4% H₂ and 96% Ar was introduced until the pressure inside the chamber reached 1 Torr. The Ni substrates were annealed at 700° C. for 1 hour at that pressure. The chamber was then pumped and maintained at a pressure of 2×10⁻⁵ Torr using a mixture of 4% H₂ and 96% Ar. The gas flow was controlled by a dc-powered piezoelectric valve. The Y₂ O₃ layers were grown on the Ni substrates at temperatures ranging from 200 to 750° C. The deposition rate for Y₂ O₃ was 1-5 Å/sec with the operating pressure of 10⁻⁵ Torr, and the final thickness was varied from 20 nm to 200 nm. The crucibles used were mostly of tungsten. Yttrium metal was used as the source. The XRD results from the θ-2θ scan (as shown in FIG. 2), ω and φ scans for as-deposited Y₂ O₃ (20 nm thick) on Ni at 700° C. are as follows: The strong Y₂ O₃ (200) from FIG. 2 revealed the presence of a good out-of-plane texture. The FWHM for Ni (200) and Y₂ O₃ (200) are 7.2° and 7.1°, and that of Ni (202) and Y₂ O₃ (222) are 11.7° and 8.4°, respectively. The Y₂ O₃ (222) pole figure for Y₂ O₃ films grown at 700° C. on Ni is shown in FIG. 3. From the XRD results, it can be concluded that Y₂ O₃ can be grown epitaxially on Ni. The CeO₂ was also grown epitaxially on textured-Ni substrates at about 625° C. using Ce metal as the source.

The pulsed laser deposition technique was used to grow YBCO at 780° C. and 185 mTorr O₂ on all the buffered-Ni substrates.

The methods described in Example 1 can also be used to grow Y₂ O₃ on textured-Cu substrates as well as on alloys of Cu and/or Ni and other metals and alloys which can be characterized by a surface having biaxial texture by e-beam evaporation.

EXAMPLE 2 Growth of Yb₂ O₃ on Textured-Ni and/or Cu Substrates by E-beam Evaporation

An electron beam (e-beam) evaporation technique was used to deposit Yb₂ O₃ films directly on Ni. The as-rolled Ni substrates were cleaned ultrasonically with both acetone and methanol and recrystallized to the desired (100) cube texture by annealing the substrates at 800° C. for 2 hours in a vacuum of 10⁻⁶ Torr. Biaxially oriented Ni substrates were mounted on a substrate holder with a heater assembly in the e-beam system. After the vacuum in the chamber had reached 1×10⁻⁶ Torr at room temperature, a gas mixture of 4% H₂ and 96% Ar was introduced until the pressure inside the chamber reached 1 Torr. The Ni substrates were annealed at 650° C. for 1 hour at that pressure. The chamber was then pumped and maintained at a pressure of 2×10⁻⁵ Torr using a mixture of 4% H₂ and 96% Ar. The gas flow was controlled by a dc-powered piezoelectric valve. The Yb₂ O₃ layers were grown on the Ni substrates at temperatures ranging from 200 to 750° C. The deposition rate for Yb₂ O₃ was 1-5 Å/sec with the operating pressure of 10⁻⁵ Torr, and the final thickness was varied from 20 nn to 200 nm. The crucibles used were of graphite. Ytterbium oxide pellets were used as the source. The XRD results from the θ-2θ scan (as shown in FIG. 4), ω and φ scans (FIGS. 5 and 6) for as-deposited Yb₂ O₃ (100 nm thick) on Ni at 700° C. is as follows: The strong Yb₂ O₃ (400) from FIG. 4 revealed the presence of good out-of-plane texture. The FWHM for Yb2O3 (400) are 11.7°, and that of Yb₂ O₃ (222) is 9.5° respectively. From the XRD results, it can be concluded that Yb₂ O₃ can be grown epitaxially on Ni.

The methods described in Example 2 can also be used to grow Yb₂ O₃ on textured-Cu substrates as well as on alloys of Cu and/or Ni and other metals and alloys which can be characterized by a surface having biaxial texture by e-beam evaporation.

EXAMPLE 3 Growth of YSZ on Y₂ O₃ -buffered Ni and/or Cu by rf Magnetron Sputtering

Initially, Y₂ O₃ films were grown epitaxially by e-beam evaporation on rolled-Ni substrated as described in Example 1. The YSZ films were grown on these Y₂ O₃ -buffered Ni substrates by rf magnetron sputtering. The Y₂ O₃ -buffered Ni substrate was mounted on a heating block inside the sputter chamber. Prior to heating the substrate, the sputter chamber was evacuated to a pressure of 1×10⁻⁶ Torr. The chamber was then back-filled with a flowing mixture of 4% H₂ and 96% Ar to a pressure of 5×10⁻² Torr. The substrate was heated to 780° C. for 15 min, and then the pressure was reduced to 1×10-2 Torr, and sputter deposited at about 780° C. for 80 min with an on-axis YSZ target located 6 cm from the substrate. The plasma power was 75 W at 13.56 MHz. The resulting YSZ film was smooth, and its thickness was estimated to be approximately 400 nm. The accompanying θ-2θ X-ray scan (as shown in FIG. 7) shows good out-of-plane texture for the YSZ which is consistent with epitaxy. From the ω (as shown in FIG. 8) and φ (as shown in FIG. 9) scans for a 400 nm thick YSZ film grown on Y₂ O₃ -buffered Ni substrates, the FWHM for YSZ (200), and YSZ (220) are 9.5° and 11.7°, respectively.

The methods described in Example 3 can also be used to grow YSZ on RE₂ O₃ -buffered Ni and Y₂ O₃ -buffered Cu as well as on alloys of Cu and/or Ni and other metals and alloys which can be characterized by a surface having biaxial texture by rf magnetron sputtering.

EXAMPLE 4 Growth of Yb₂ O₃ on Y₂ O₃ -buffered or CeO₂ -buffered Ni and/or Cu by rf Magnetron Sputtering

Initially, Y₂ O₃ or CeO₂ films were grown epitaxially by e-beam evaporation on Rolled-Ni substrates as described in Example 1. The Yb₂ O₃ films were grown on these Y₂ O₃ -buffered or CeO₂ -buffered Ni substrates by rf magnetron sputtering. The buffered substrate was mounted on a heating block inside the sputter chamber. Prior to heating the substrate, the sputter chamber was evacuated to a pressure of about 1×10⁻⁶ Torr. The chamber was then back-filled with a flowing mixture of 4% H₂ and 96% Ar to a pressure of 5×⁻² Torr. The substrate was heated to 780° C. for 15 min, and then the pressure was reduced to 1×10⁻² Torr, and sputter deposited at about 780° C. for 60 min with an on-axis Yb₂ O₃ target located 6 cm from the substrate. The plasma power was 75 W at 13.56 MHz. The resulting Yb₂ O₃ film was smooth, and its thickness was estimated to be approximately 400 nm. FIG. 10 shows the η-2θ X-ray scan for a 400 nm thick Yb₂ O₃ on Y₂ O₃ -buffered Ni substrates. The accompanying θ-2θ X-ray scan for a 400 nm thick Yb₂ O₃ on CeO₂ -buffered Ni substrates (as shown in FIG. 11) shows good out-of-plane texture for the Yb₂ O₃ which is again consistent with epitaxy. From the (ω and φ scans for the Yb₂ O₃ /CeO₂ /Ni film the FWHM for Ni (002), CeO₂ (002), and Yb₂ O₃ (002) are 12.2°, 8.2°, and 10.7°, and that of Ni (111), CeO₂ (111), and Yb₂ O₃ (222) are 10.3°, 8.7° and 8.7°, respectively. From the XRD results, it can be concluded that Yb₂ O₃ can be grown epitaxially on Y₂ O₃ -buffered Ni and CeO₂ -buffered Ni substrates. The Yb₂ O₃ films were also grown epitaxially on YSZ/CeO₂ /Ni.

YBCO was then grown by pulsed laser deposition on three epitaxial laminates of Yb₂ O₃ /CeO₂ /Ni, Yb₂ O₃ /YSZ/CeO₂ /Ni, and Yb₂ O₃ /Y₂ O₃ /Ni. The typical YBCO thickness was about 300 nm for Yb₂ O₃ /CeO₂ /Ni and Yb₂ O₃ /YSZ/CeO₂ /Ni, and about 400 nm for Yb₂ O₃ /Y₂ O₃ /Ni. From the XRD results, the YBCO films grown on all architectures were found to be epitaxial. The typical ω and φ scans for YBCO on Yb₂ O₃ /CeO₂ -buffered Ni substrates with FWHM of 7.7° for YBCO (006) and 9.5° for YBCO (103) films are shown in FIGS. 12 and 13. The typical ω and φ scans for YBCO on Yb₂ O₃ /YSZ/CeO₂ -buffered Ni substrates with FWHM of 6.5° for YBCO (006) and 8.9° for YBCO (103) films are shown in FIGS. 14 and 15. The X-ray data (FIGS. 12-15) demonstrate the presence of a single texture component of YBCO on Yb₂ O₃ layers as compared to that of two texture components of YBCO grown directly on YSZ surface. The four probe resistivity plots showed a T_(c) (zero resistance) of 90-92K for all three films (FIGS. 16, 17 and 18). The transport critical current-density J_(c) was estimated to be 0.7×10⁶ A/cm² for YBCO/Yb₂ O₃ /CeO₂ /Ni and 1.4×10⁶ A/cm² for YBCO/Yb₂ O₃ /YSZ/CeO₂ /Ni, and 0.8 A/cm² for YBCO/Yb₂ O₃ /Y₂ O₃ /Ni at 77° K and zero field. The temperature and magnetic field dependence of normalized J_(c) of these superconductors are shown in FIGS. 19 and 20. Also included are the data on films with YBCO deposited on standard YSZ/CeO₂ /Ni architecture for comparison. As can be seen from these figures that the performance of YBCO deposited on alternative buffer architectures as disclosed in the present invention is similar to that of the standard RABiTS architecture, and demonstrate the presence of epitaxy and resulting strongly linked nature of the alternate buffer layers.

The methods described in Example 4 can also be used to grow Yb₂ O₃ on Y₂ O₃ -buffered or CeO₂ -buffered Cu as well as on alloys of Cu and/or Ni and other metals and alloys which can be characterized by a surface having biaxial texture by rf magnetron sputtering.

EXAMPLE 5 Growth of Gd₂ O₃ on Textured-Ni Substrates by Reactive Evaporation

An electron beam (e-beam) evaporation technique was used to deposit Gd₂ O₃ films directly on Ni. The as-rolled Ni substrates were cleaned ultrasonically with both acetone and methanol and recrystallized to the desired (100) cube texture by annealing the substrates at 800° C. for 2 hours in a vacuum of 10⁻⁶ Torr. Biaxially oriented Ni substrates were mounted on a substrate holder with a heater assembly in the e-beam system. After the vacuum in the chamber had reached 1×10⁻⁶ Torr at room temperature a gas mixture of 4% H₂ and 96% Ar was introduced until the pressure inside the chamber reached 1 Torr. The Ni substrates were annealed at 700° C. for 1 hour at that pressure. The chamber was then pumped and maintained at a pressure of 2×10⁻⁵ Torr using a mixture of 4% H₂ and 96% Ar. The gas flow was controlled by a dc-powered piezoelectric valve. To understand the chemistry of the oxide formation, a Dycor Quadruple Gas Analyzer was mounted in the e-beam system. The background H₂ O pressure (pH₂ O) in the system was around 1×10⁻⁵ Torr. The crucibles used were usually graphite. Gadolinium metal was used as the source. The Gd₂ O₃ layers were grown on the Ni substrates at temperatures ranging from 200 to 800° C. The deposition rate for Gd₂ O₃ was 1-5 Å/sec with the operating pressure of 10⁻⁵ Torr, and the final thickness was varied from 10 to 500 nm. During the deposition, the H₂ O pressure slowly fell to 4×10⁻⁶ Torr (when Quartz Crystal Monitor was reading about 10 nm). The H₂ O was introduced into the system through a valve to maintain the H₂ O pressure around 1×10⁻⁵ Torr throughout the deposition. This H₂ O pressure was sufficient to oxidize the film to form Gd₂ O₃ preferentially without oxidizing the Ni underneath. Also, just before the deposition, the Gd metal was evaporated for a few seconds with the shutter closed. This was critical in changing the partial pressure of from 10⁻⁷ Torr to 10⁻⁸ Torr. The Gd metal acts as an oxygen getter. The XRD results from the θ-2θ scan (as shown in FIG. 21), ω and φ scans for as-deposited Gd₂ O₃ (90 nm thick) on Ni at 700° C. is as follows: The strong Gd₂ O₃ (400) from FIG. 21 revealed the presence of a good out-of-plane texture. The FWHM for Ni (200) and Gd₂ O₃ (400) are 7.1° and 5.2° (FIG. 22), and that of Ni (111) and Gd₂ O₃ (222) are 10.1° and 9.2° (FIG. 23), respectively. The Gd₂ O₃ (222) pole figure for Gd₂ O₃ films grown at 700° C. on Ni is shown in FIG. 24. From the XRD results, it can be concluded that Gd₂ O₃ can be grown epitaxially on Ni, Cu, and alloys thereof.

                                      TABLE 1                                      __________________________________________________________________________                      a/2√2                                                                      Melting                                                                              Temp. @ vap. pressure                                RE.sub.2 O.sub.3                                                                       Structure                                                                           a   or point (RE)                                                                           10.sup.-6 Torr                                                                      10.sup.-4 Torr                                  type    type (Å)                                                                            a/√2                                                                       data for pure metals (° C.)                         __________________________________________________________________________     Y.sub.2 O.sub.3                                                                        cubic                                                                               10.604                                                                             3.750                                                                             1509  973  1157                                            La.sub.2 O.sub.3                                                                       cubic                                                                               11.327                                                                             4.005                                                                              920  1212 1388                                            CeO.sub.2                                                                              cubic                                                                               5.411                                                                              3.827                                                                              795  1150 1380                                            PrO.sub.1.83                                                                           cubic                                                                               5.47                                                                               3.868                                                                              931  950  1150                                            Nd.sub.2 O.sub.3                                                                       cubic                                                                               11.08                                                                              3.918                                                                             1024  871  1062                                            Sm.sub.2 O.sub.3                                                                       cubic                                                                               10.927                                                                             3.864                                                                             1072  460   573                                            Eu.sub.2 O.sub.3                                                                       cubic                                                                               10.868                                                                             3.843                                                                              822  360   480                                            Gd.sub.2 O.sub.3                                                                       cubic                                                                               10.813                                                                             3.824                                                                             1312  900  1175                                            Tb.sub.2 O.sub.3                                                                       cubic                                                                               10.730                                                                             3.794                                                                             1357  950  1150                                            Dy.sub.2 O.sub.3                                                                       cubic                                                                               10.665                                                                             3.771                                                                             1409  750   900                                            Ho.sub.2 O.sub.3                                                                       cubic                                                                               10.606                                                                             3.750                                                                             1470  770   950                                            Er.sub.2 O.sub.3                                                                       cubic                                                                               10.548                                                                             3.730                                                                             1497  775   930                                            Tm.sub.2 O.sub.3                                                                       cubic                                                                               10.487                                                                             3.708                                                                             1545  554   680                                            Yb.sub.2 O.sub.3                                                                       cubic                                                                               10.436                                                                             3.690                                                                              824  590   690                                            Lu.sub.2 O.sub.3                                                                       cubic                                                                               10.390                                                                             3.674                                                                             1652       1300                                            (Y.sub.0.95 Eu.sub.0.05).sub.2 O.sub.3                                                 cubic                                                                               10.604                                                                             3.750                                                         Y.sub.2 Ce.sub.2 O.sub.7                                                               cubic                                                                               5.370                                                                              3.798                                                         (Gd.sub.0.6 Ce.sub.0.4).sub.2 O.sub.3.2                                                cubic                                                                               10.858                                                                             3.839                                                         (Gd.sub.0.3 Ce.sub.0.7)O.sub.1.85                                                      cubic                                                                               5.431                                                                              3.841                                                         __________________________________________________________________________

The present invention clearly demonstrates the epitaxial growth of of Y₂ O₃ and RE₂ O₃ layers on rolled-Ni and/or Cu substrates with or without additional buffer layers. The present invention also demonstrates new single and multi-buffer layer architectures for high current YBCO conductors.

Further, processing conditions such as those described hereinabove may be used to grow other buffer layers such as REAlO₃ (RE=Rare Earth), AEZrO₃ (AE=Ca,Sr,Ba), RE₂ Zr₂ O₇ (RE=Rare Earth), Ca-stabilized Zirconia, Ti, Nb or Zr doped CeO₂, and AECeO₃ (AE=Ca,Sr,Ba) on rolled substrates. Other metallic substrates may also be used for growing these buffer layers.

Various techniques which can be used to deposit these buffer layers include but are not limited to: physical vapor deposition techniques which include electron-beam evaporation, rf magnetron sputtering, pulsed laser deposition, thermal evaporation, and solution precursor approaches, which include chemical vapor deposition, combustion CVD, metal-organic decomposition, sol-gel processing, and plasma spray.

While the preferred embodiments of the invention have been shown and disclosed, it will be obvious to those skilled in the art that various changes and modifications can be made therein without departing from the scope of the invention defined by the appended claims. 

We claim:
 1. A method for making a biaxially textured article comprising the steps of:(A) providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and (B) epitaxially depositing upon the biaxially textured surface of the substrate a buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.
 2. The method for making a biaxially textured article as described in claim 1 wherein the buffer layer is a first buffer layer comprising Y₂ O₃ ; the method further comprising the additional step of:(C) epitaxially depositing upon the biaxially textured surface of the Y₂ O₃ a second buffer layer selected from the group consisting of RE₂ O₃ and YSZ.
 3. A method for making a biaxially textured article comprising the steps of:(A) providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; (B) epitaxially depositing upon the biaxially textured surface of the substrate a first buffer layer comprising CeO₂ ; (C) epitaxially depositing upon the biaxially textured surface of the CeO₂ a second buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.
 4. A method for making a biaxially textured article comprising the steps of:(A) providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; (B) epitaxially depositing upon the biaxially textured surface of the substrate a first buffer layer comprising CeO₂ ; (C) epitaxially depositing upon the biaxially textured surface of the CeO₂ a second buffer layer comprising YSZ, and (D) epitaxially depositing upon the biaxially textured surface of the YSZ a third buffer layer selected from the group consisting of Y₂ O₃ and RE₂ O₃.
 5. A method for making a biaxially textured article comprising the steps of:(A) providing a substrate comprising at least one metal, the substrate having a surface exhibiting biaxial texture; and (B) epitaxially depositing upon the biaxially textured surface of the substrate a buffer layer comprising (RE')_(x) O_(y), wherein x is about 2.0, and y is between about 3.0 and about 3.7. 